Maxtech SI8710RP Two component transparent waterproof dielectric insulating liquid silicone gel for electronics PCB LED
∎Product Description
SI8710RP is two-component elastic transparent self-healing silicone gel, when cured it will become elastomer with buffer and self-recovery property. Used to isolate moisture and another noxious pollutant from contacting the circuit board, also used as a dielectric of high voltage. The other usage is a stress relief for protecting circuits and interconnect devices from high temperatures and mechanical stress..After curing, Maxtech gel gives excellent resistance to moisture, has high insulating properties and very good chemical resistance.
∎Key Features
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1:1 addition type, good adhesive strength and self-healing
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High elongation, excellent flexibility for mechanical stress relieving
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Low oil penetration after cured, good anti-poisoning property
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Good dielectric in high temperature for high voltage protection
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Excellent aging resistance and weatherability
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Excellent waterproof, corrosion prevention, moisture-proof and chemical media resistance
liquid silicone gel for electronics
Optically clear silicone gels are ideal for potting and encapsulation in all electronics
Liquid silicone gel for electronics,Optical Fiber Splice Closure
liquid silicone gel for electronics
∎Typical Applications
●Used for encapsulation of various modules, semi-conductor, IGBT, automotive ECU module, IC chip, weighing sensor, waterproof connector, Electrical insulation and moisture protection for low-voltage applications, particularly suitable for insulating cables and wires in junction boxes.
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∎Technical Data Table
PROPERTY STANDARD/UNITS VALUE of SI8710RP
---- ---- PART A PART B
Material ---- Polysiloxane Hydrogen polysiloxane
Color Visual inspection Colorless Liquid Colorless Liquid
Viscosity 25°C, cps 800~1000 800~1000
Density 25°C, g/cm3 0.99 0.99
Mixture/mass ratio ---- A:B=100:100
Viscosity of mixture 25°C, cps 800~1000
Operation time 25°C, min 50
Fixture Time 25°C, hour 5
Cure condition ---- 25°C/60mins, 80°C/15min
Cured appearance ---- Transparent gel
Needle penetration 1/10 mm 110
Dielectric strength KV/mm 25
Volume resistance DC500V, ohm-cm 1.0×1015
Loss factor 1 MHz ＜0.001
Dielectric constant 1 MHz 2.8
Application temperature °C -60~260
Note：All above data were tested under standardized condition, or tested by further experiments.
How to use ?
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Mix Part A and Part B by 1:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements.
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Still the potted component to let out the bubbles. It can be heat cured, about 15mins in 80°C. It needs about 1 hours cured under room temperature.
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Vacuum defoaming can improve the performance of cured product.
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Seal the remaining products tightly after use.
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Low temperature will slow the curing speed; heat curing is recommended.
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It's hard for SI8710RP to cure if contact with sulfur, amine or Sn
∎Packing Specification
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●Part A—10 KG/Bucket
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●Part B—10 KG/ Bucket.
∎Transport &Storage
● When stored at or below 25°C in the original unopened containers, this product has a usable life of 12 months from the date of production. A sampling test is necessary for products that exceed shelf life before taking use.
It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
