Silicone gel for electronics
Silicone gel is a unique sealant for electronic potting and encapsulation. Once mixed at the proper ratio, these non-corrosive, two component silicone compounds will cure to solid rubber.
Silicone gel is optimized for encapsulation of various modules, semi-conductor, IGBT, automotive ECU module, IC chip, weighing sensor, waterproof connector, junction box enclosures, cable splice kits, electrical insulation, and a plethora of potting and encapsulation applications.
And Silicone Dielectric Gel is suitable for sealing and protecting various PCB system assemblies,encapsulation of various modules, semi-conductor, IGBT, automotive ECU module, IC chip, weighing sensor, waterproof connector especially those with delicate components.
The Feature of Silicone Gel:
•Room temperature or heat accelerated cure • Available in clear or red • Heat cure for increased processing speeds • Low viscosity allows good flow under components
Maxtech supply different grade Silicone can meet all the request.
Color: Clear
Packaging: Part A:10 KG/Pot , Part B:10 KG/Pot
The Ratio of A and B： Part A : Part B =1 :1
Cure condition:25°C/24hour, 80°C/30min
Needle penetration: 75
Application: Used for encapsulation of various modules, semi-conductor, IGBT, automotive ECU module, IC chip, weighing sensor, waterproof connector.
Color: Clear
Packaging: Part A:10 KG/Pot , Part B:10 KG/Pot
The Ratio of A and B： Part A : Part B =1 :1
Cure condition:25°C/6hour, 80°C/30min
Needle penetration: 110mm
Application: Used for encapsulation of various modules, semi-conductor, IGBT, automotive ECU module, IC chip, weighing sensor, waterproof connector.
Color: Clear
Packaging: Part A:10 KG/Pot , Part B:10 KG/Pot
The Ratio of A and B： Part A : Part B =1 :1
Cure condition:25°C/1hour, 80°C/15min
Needle penetration:110
Application: Used for encapsulation of various modules, semi-conductor, IGBT, automotive ECU module, IC chip, weighing sensor, waterproof connector.
Color: Light Blue / Transparent
Packaging: Part A:10 KG/Pot , Part B:10 KG/Pot
The Ratio of A and B： Part A : Part B =1 :1
Cure condition:25°C/8hour
Needle penetration:110
Application: Used for encapsulation of various modules, semi-conductor, IGBT, automotive ECU module, IC chip, weighing sensor, waterproof connector.
Color: Light Blue / Transparent
Packaging: Part A:10 KG/Pot, Part B:10 KG/Pot
The Ratio of A and B： Part A: Part B =1 :1
Cure condition:25°C/8hour
Needle penetration:110
Application: Used for encapsulation of various modules, semi-conductor, IGBT, automotive ECU module, IC chip, weighing sensor, waterproof connector,semiconductor devices.
Color: Transparent
Packaging: Part A:10 KG/Pot, Part B:10 KG/Pot
The Ratio of A and B： Part A: Part B =1 :1
Cure condition:25°C/10hours or 80 ℃/10mins
Needle penetration:80
Application: The cured gel is used in some medical mattresses, headrests, skin stickers, electric parts, IGBT modules, junction boxes, auto control, and inverter.
Maxtech SI8709 Two-component Transparent Liquid Self-healing Silicone Potting Gel For Electronic Component
Color: Light Blue / Transparent
Packaging: Part A:10 KG/Pot , Part B:10 KG/Pot
The Ratio of A and B： Part A : Part B =1 :1
Cure condition:25°C/8hour
Needle penetration:110
Application: Used for encapsulation of various modules, semi-conductor, IGBT, automotive ECU module, IC chip, weighing sensor, waterproof connector.
Maxtech SI8721 Two Component Flexible Medical Silicone Gel
Color: Transparent
Packaging: Part A:10 KG/Pot, Part B:10 KG/Pot
The Ratio of A and B： Part A : Part B =1 :1
Cure condition:25°C/6hour, 120℃/15mins
Application:
● Suitable for sticking with skin, used for wound stickers, Scar sheet, eye patch and Nipple cover
● Also for filling the cover bag of headrest, seat lumbar pad etc
Color: Transparent
Packaging: Part A:10 KG/Pot , Part B:10 KG/Pot
The Ratio of A and B： Part A : Part B =1 :1
Cure condition:25°C/6hour or 80℃, 30mins
Needle penetration:100
Application: Used for encapsulation of various modules, semi-conductor, IGBT, automotive ECU module, IC chip, weighing sensor, waterproof connector.
Color: Transparent
Packaging: Part A:10 KG/Pot , Part B:10 KG/Pot
The Ratio of A and B： Part A : Part B =1 :1
Cure condition:25°C/24hour,80°C /30min
Needle penetration: 75 1/mm
Application: Used for encapsulation of various modules, semi-conductor, IGBT, automotive ECU module, IC chip, weighing sensor, waterproof connector.
Color: Transparent
Packaging: Part A:10 KG/Pot , Part B:10 KG/Pot
The Ratio of A and B： Part A : Part B =1 :1
Cure condition:80°C /30min
Hardness:10 Shore00
Application:
●Provide a glassy clear appearance to parts manufactured using it. The rubber is an excellent candidate to consider for the cost-efficient manufacture of highly transparent optical parts, with very low modulus.
●Rain-light sensors, camera systems, optical sensors.
Color: Transparent
Packaging: Part A:10 KG/Pot , Part B:10 KG/Pot
The Ratio of A and B： Part A : Part B =1 :1
Cure condition:23°C /2 hour; 80°C /30min; 120°C /15min
Hardness:60 Shore00
Application:
●Provide a glassy clear appearance to parts manufactured using it. The rubber is an excellent candidate to consider for cost-efficient manufacture of highly transparent optical parts, with very low modulus.
●Rain-light sensors, camera systems, optical sensors.
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Color: Transparent/Black
Packaging: Part A:10 KG/Pot , Part B:10 KG/Pot
The Ratio of A and B： Part A : Part B =1 :1
Cure condition:25°C/20~60mins, 80℃/10mins
Hardness: 20~40 Shore 00
Application: Used for encapsulation of various modules, semi-conductor, IGBT, automotive ECU module, IC chip, weighing sensor, waterproof connector.